TR7007 SII Ultra 3-D high-speed solder paste inspection performs at speed up to 180 cm²/sec.

Inspects low solder bridges and compensates board warpage for eliminating local PCB deformation. Eases data exchange between production line and MES to enable data traceability for connected factory. Uses YMS 4.0 Industry 4.0 data-driven management system.

Test Research Inc.
tri.com.tw/en/index.html

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