ProMetrics monitors thermal profiles during soldering. For single- and dual-lane systems and suitable for vacuums.

Checks how previously created profile corresponds to required, predefined specifications. Process window index quantifies quality of thermal process; determined by specification of solder paste and most heat-sensitive component. Generation of real-time data for each component allows exact determination of assembly position and detects deviations or delays in soldering system. Process changes reportedly can be detected immediately. Integrating ProMetrics into ViCON software, errors in data transmission to system such as MES can be excluded and are available centrally in MES for each assembly. Uniform logging occurs in ViCON. Representation of envelope curve visualizes deviations of soldering profile from specified parameters. Alarm messages show deviations from temperature profile outside envelope curve. Solderstar software is used to record data; integrated into ViCON and helps with thermal profiling. Using a measurement data logger, temperatures of reference board are recorded to check process stability. Comes with monitors to record temperatures; temperatures in heating zones are recorded by sensors.

Rehm Thermal Systems
rehm-group.com/en/index.html

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