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PF918-P250 SnAgBi3 alloy offers high thermal impact reliability.

Reportedly increases thermal reliability performance by a min. of 30%. Is said to provide better mechanical shock performance than SAC 305 and SAC 405. Is suitable for use in consumer electronics, servers and automotive electronics applications. Has similar melting point to SAC 305; regular SAC 305 reflow profile can be applied. With flux design, voiding reportedly can be controlled to less than 10%.

Solder Paste PF918 P250 pic21053104

Shenmao America
shenmao.com

 

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