Loctite Ablestik ABP 8068TD high thermal die attach paste is for use in applications where no die back-side metallization is required.

Is option for bare silicon die integration and is well-suited for high power applications. Allows packaging specialists to satisfy requirement for high heat dissipation in applications where bare silicon die are used. Extends benefits of semi-sintering to power packages using different types of die and lead frame finishes. Has bulk thermal conductivity of 50 W/m-K and was evaluated across several standard testing regimens with bare Si die and Ag-metallized die of various dimensions up to 5mm x 5mm, as well as on copper, Ag and pre-plated lead frame finishes. Is consistent with other Henkel semi-sintering adhesives; exhibits excellent workability, good dispensing performance, no resin bleed out on any tested lead frames, strong adhesion to all surfaces, and long open (2mm x 2mm die at 2 hrs.) and stage times (2mm x 2mm die at 24 hrs.). Achieves MSL 3 on most tested die finish/lead frame combinations and MSL 1 for several Ag-BSM and bare Si die/lead frame pairings.

Henkel
Henkel.com

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