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SINGAPORE − Advanced Interconnect Technologies, a provider of semiconductor assembly and test services, announced that it has received JEDEC approval for its QFN-style Etched Leadless Package.

AIT’s patented ELP is a Quad Pb-free staggered and inline multi-row package with metallized terminals along the edges of the bottom surface. The package is offered in two- or three-row configurations. ELP reportedly offers a small footprint, low cost and design flexibility for higher I/O count.