IRVINE, CA – The US Patent and Trademark Office has allowed a patent covering Henkel Corp.’s Ablestik Self-Filleting die-attach products and controlled flow technique. 
 
The patent broadly discloses the parameters of the process required to achieve a bondline fillet, using die attach paste materials. It covers a method for attaching a semiconductor die to a substrate or to another die in a stacked arrangement. 
 
The method comprises dispensing an adhesive between the die and the substrate, or between two dies, and subjecting the adhesive to conditions suitable to cure the adhesive. With a controlled flow technique, bondlines as thin as 10 µm have been achieved and can be modified based on application-specific requirements.