News
SMYRNA, GA – Registration for Virtual PCB is now open. Virtual PCB, sponsored by UP Media Group, is the industry's first virtual tradeshow for the PCB design, fabrication and assembly industry.
The online event will take place Nov. 12 – 13.
The free, two-day show can be accessed from anywhere in the world via a computer.
Virtual PCB provides on-demand educational presentations; private communications with exhibitors and other attendees; worldwide access to exhibitor booths and sessions; downloadable literature and product brochures; white papers; live, scheduled group chats with industry experts; live group chats with peers, and auditorium content.
For more information, visit www.virtual-pcb.com. To register, visit http://vshow.on24.com/clients/vshow/upmedia/register.htm.
The online event will take place Nov. 12 – 13.
The free, two-day show can be accessed from anywhere in the world via a computer.
Virtual PCB provides on-demand educational presentations; private communications with exhibitors and other attendees; worldwide access to exhibitor booths and sessions; downloadable literature and product brochures; white papers; live, scheduled group chats with industry experts; live group chats with peers, and auditorium content.
For more information, visit www.virtual-pcb.com. To register, visit http://vshow.on24.com/clients/vshow/upmedia/register.htm.
SAN JOSE – Freescale Semiconductors director of packaging technology Glenn Daves will keynote an upcoming MEPTEC symposium on packaging.
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
To register, visit www.meptec.org.
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
To register, visit www.meptec.org.
TUCSON, AZ – The ESD Association members elected to its board of directors Gianluca Boselli, Texas Instruments; Tom Larson, Trek Inc.; Michelle McSwain, TW Clean and consultant Steven H. Voldman.
The new board will serve for a three-year term beginning Jan. 1.
The board also elected its officers for a one-year term, including David E. Swenson, Affinity Static Control Consulting, president; Donn Bellmore, Universal Instruments, senior vice president; and Leo G. Henry, ESD-TLP Consulting, vice president.
The ESDA is an organization dedicated to furthering the technology and understanding of electrostatic discharge.
The new board will serve for a three-year term beginning Jan. 1.
The board also elected its officers for a one-year term, including David E. Swenson, Affinity Static Control Consulting, president; Donn Bellmore, Universal Instruments, senior vice president; and Leo G. Henry, ESD-TLP Consulting, vice president.
The ESDA is an organization dedicated to furthering the technology and understanding of electrostatic discharge.
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