News
SMYRNA, GA – The PCB West 2008 two-day exhibition will be held Sept. 16 – 17 at the Santa Clara Marriott in Santa Clara, CA.
The exhibition features a sold-out show floor of 46 exhibiting companies for the PCB design industry. Exhibitors include Advanced Assembly, Applied Spectra, Dassault Systemes, Elgris Technologies, EMA Design Automation, Intercept Technology, IPC, JetPCB, National Instruments, Sigrity, Taconic, T-Tech, Valor Computerized Systems, X2y Attenuators, and others.
PCB West is for PCB engineers, designers, fabricators and managers and includes a five-day conference of more than 35 technical courses.
For more information, visit www.pcbwest.com.
TAIPEI – Compal Electronics today lowered its annual sales guidance by 9 to 13%, citing slowing US and European demand. The company, the world's second largest contract assembler of laptops, expects to ship 28 million to 29 million units this year, down from a previous forecast of 32 million. The company also forecast third-quarter shipments would grow 15% sequentially, down from earlier guidance of 20%.
BANNOCKBURN, IL – A new standard for testing and identifying the worst-case thermal process limitations for all electronic components that may be processed as part of a assembly was released today.
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, covers passives, connectors, switches and other devices. The standard was developed jointly by IPC, JEDEC and ECA (Electronic Components Association).
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, covers passives, connectors, switches and other devices. The standard was developed jointly by IPC, JEDEC and ECA (Electronic Components Association).
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