News
TOKYO — A 7.2 magnitude earthquake rocked Kurihari city, north of Tokyo, on Saturday and led to shutdowns of operations at several electronics makers.
A Fujitsu Ltd. semiconductor factory and certain factories affiliated with Sony were shut down, company officials reported.
FRANKFURT -- May semiconductor sales in Germany were down 19% year-on-year, the Electronics Industry Association (ZVEI) said.
In April and March, sales were down 16% year-on-year, respectively, ZVEI said.
The preliminary book-to-bill ratio in May was 1.01, up from 0.94 in April. The ratio is calculated by the value of orders divided by the value of shipments. A ratio of 1.01 means that for every $100 worth of semiconductors shipped, $101 worth of semiconductors were ordered.
A ratio above 1.0 is considered a sign of expansion.
In April and March, sales were down 16% year-on-year, respectively, ZVEI said.
The preliminary book-to-bill ratio in May was 1.01, up from 0.94 in April. The ratio is calculated by the value of orders divided by the value of shipments. A ratio of 1.01 means that for every $100 worth of semiconductors shipped, $101 worth of semiconductors were ordered.
A ratio above 1.0 is considered a sign of expansion.
KUALA LUMPUR – Unisem and its subsidiary Unisem-Advanpack Technologies have entered into an agreement with FlipChip International to license FCI’s wafer bumping and wafer level packaging technologies.
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
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