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TORONTO – EMS provider Celestica Inc. announced net earnings for the first quarter 2008 were $29.8 million, compared to a net loss of $34.3 million for the same period last year.

Revenue was $1.84 billion, down a slight 0.33% year-over-year.

Adjusted net earnings were $35.4 million, compared to an adjusted net loss of $9.1 million year-over-year.

Restructuring charges in the quarter were $3.3 million compared to $8 million in the first quarter of 2007.

For the second quarter, ending June 30, the company anticipates revenue to be in the range of $1.8 billion to $2 billion.

PEABODY, MA – Carl Zeiss SMT, provider of electron- and ion-beam imaging and analysis solutions, opened its North American headquarters in Peabody, MA, near Boston.

Representing an investment of more than $9 million, the 53,000 sq. ft. facility houses the research, development and production center for the Orion helium ion microscope product line.

The facility also serves as the North American hub for sales and service for Zeiss particle beam instruments and houses the Carl Zeiss Nano Solutions Center Peabody. This center is a demonstration and application development facility hosting six electron- and ion-beam systems for nanoscale imaging, analysis and structuring.

The facility is the home office for more than 150 employees.

BRUSSELS – The European organization charged with collecting and collating comments to the latest RoHS exemption list has scheduled a series of meetings to discuss the preliminary input with stakeholders.

Öko-Institut e.V. has signaled its intention to discuss the use of lead in high-melting-temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead); in solders for servers, storage and storage array systems, network infrastructure and telecommunication equipment; and in electronic ceramic parts (e.g., piezoelectronic devices). Cadmium is also up for discussion, as are seven other exemptions.

Not expected to be discussed is an exemption for lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight; lead in solders for electrically connecting semiconductor die and carriers within flip chip packages; or lead in finishes of fine-pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames. It is unclear whether by foregoing discussion on those proposals the Institute is suggesting a fait accompli.

"The aim is to discuss these nine exemptions within five days," Öko spokeswoman StÃ©phanie Zangl said.

The organization has put online all non-confidential documents obtained during the consultation: http://rohs.exemptions.oeko.info/index.php?id=17.

The meetings will be held June 9-13, and is by invitation as the number of participants is limited, Zangl said.