News
TAIPEI -- Microsoft and H-P will establish a joint technology center in Taiwan, focused on investing in
advanced software, hardware and improving technical support to
its Taiwan partners. About 80% of the world's PCs are built in Taiwan.
FRANKFURT -- Siemens AG plans to divest its Electronic Assembly Systems unit by the end of September, the company said today. The unit employs about 2,100 workers and had reported sales in the "medium three-digit million euros range," a German newspaper reported.
ST. LOUIS -- LaBarge Inc. today raised its earnings guidance, announcing
that it expects financial results for its fiscal third quarter will
significantly top those of the last quarter and last year.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing