News
BANNOCKBURN, IL – A new report on silicon-on-chip and system-in-package integration identifies embedded components as a key emerging technology in component and product miniaturization.
The research, by Prismark Partners, looks at the impact of miniaturization on the supply chain and how it drives certain technology and business shifts.
TOYKO – Expanded significantly from last year’s edition,
Nepcon World Tokyo used both the massive East and West Halls at the Tokyo Big
Sight convention center, in part to accommodate the arrival of a major fiber
optics wing. Even better: The halls were packed with visitors all three days.
SAN JOSE – North American-based semiconductor equipment manufacturers saw orders slip 18% year-over-year in December, the SEMI trade group said today.
For the month, manufacturers posted $1.23 billion in orders, up 9% over November.
For the month, manufacturers posted $1.23 billion in orders, up 9% over November.
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