News
ELKHART, IN -- CTS Corp. today announced second-quarter revenues of $169.6 million and net earnings of $5.9 million. The company, which also makes components, was boosted by strength for its EMS services.
WASHINGTON -- The Electronic Industries Alliance's board of directors has approved a plan that would split the assets of the trade goup coalition across five distinct organizations.
Under the plan, EIA will distribute its assets equally among its four current member associations -- The Electronic Components, Assemblies & Materials Association (ECA); the Government Electronics and Information Technology Association (GEIA); the JEDEC Solid State Technology Association (JEDEC); and the Telecommunications Industry Association -- and the Consumer Electronics Association, a former member of EIA.
Under the plan, EIA will distribute its assets equally among its four current member associations -- The Electronic Components, Assemblies & Materials Association (ECA); the Government Electronics and Information Technology Association (GEIA); the JEDEC Solid State Technology Association (JEDEC); and the Telecommunications Industry Association -- and the Consumer Electronics Association, a former member of EIA.
SUNNYVALE, CA – A new “reverse order” interconnection method describes a way to produce a finished electronics assembly with neither solder nor a circuit board.
The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence. What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.
The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence. What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Long Island Expo & Tech Forum
- BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America
- High-Performance TIMs: Beyond Traditional TIM Materials
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum