MINNEAPOLIS – David Hillman and Matt Hamand of Rockwell Collins took home top honors at the SMTA International conference, winning the Best of Conference award for their paper, "Lead-Free Feasibility Program: Assembly and Testing of a Functional IPC Class 3 Avionics Data Unit.”
TOKYO – Orders for Japanese-made semiconductor equipment fell in October, the eighth straight month of decline as chipmakers rein in spending, an industry group said.
Orders fell 10.9% year-over-year to 123.17 billion yen ($1.12 billion), with a fall in orders for wafer processing equipment overcoming higher demand for testers, the Semiconductor Equipment Association of Japan said.
HEMEL HEMPSTEAD, UK – Henkel has completed the expansion of its Electronics Group’s R&D and applications laboratory here, the site of the company’s European headquarters.
The recent investment in the 225-sq. meter facility permits additional development and testing capabilities and a complete remodel, Henkel says.
The lab has advanced conformal coating development tools, including various automated selective dispensing applicators, and is equipped with a full production line for PCB assembly and the latest testing equipment. Equipment includes screen printers, reflow ovens, solder paste deposition measurement systems, x-ray equipment, wave soldering systems, and analytical, microscopy and metallurgical tools.