News
SEOUL – Samsung Electronics’ second-quarter net profit fell 5% year-over-year, says its quarterly report. And profits were down 11% from the first quarter, driven in part by DRAM price decline.
FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
MINNEAPOLIS, MN – The 2007 Charles Hutchins Grant Award, cosponsored by Circuits Assembly and SMTA, has been given to Gayatri Cuddalorepatta for her project, Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Long Island Expo & Tech Forum
- BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America
- High-Performance TIMs: Beyond Traditional TIM Materials
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum