In addition, the two companies are working on the manufacture of Tezzaron’s 3-D devices, and hope to see them become the first 3-D ICs to be manufactured in volume.
 
With Tezzaron’s FaStack technology, device circuitry is divided into sections built onto separate wafers using standard processing. Chartered enables 3-D stacking of these wafers by building hundreds of thousands of Tezzaron’s embedded thru-silicon interconnections, called Super-Contacts, into the circuitry on each wafer. The wafers are then aligned with a precision of 0.5µm, bonded, thinned, and diced into individual devices. A FaStack chip functions as a single device.
 
Chartered and Tezzaron will enhance the 3-D IC designs and build them into wafers produced by Chartered. Tezzaron plans to offer many types of 3-D IC memories in two, three and five layers using NanoTSV technology.
 
Chartered is also manufacturing Tezzaron’s 3T-iRAM family of 2-D 72Mb memory devices.