News
BANNOCKBURN, IL — A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconductor chips, without which the semiconductor supply chain is likely to remain weak and vulnerable.
HOUSTON -- Alert Tech, a technology company based in Houston, has launched a new surface mount technology division, specializing in low-volume printed circuit board development and assembly.
TAIPEI – Foxconn’s chairman Young Liu expects to boost the company’s gross margin to 7% from 3-4% by the end of the year, according to reports. Gross margin above 10% in the long term is the goal.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration