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SUNNYVALE, CA – A new “reverse order” interconnection method describes a way to produce a finished electronics assembly with neither solder nor a circuit board.

The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence. What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.  Read more ...
YANTAI, CHINA – Henkel is continuing to expand in the solder sphere market, recently opening its second major production hub. The 4,100 sq. meter plant will manufacture solder spheres and Type 1 through Type 7 solder powders for semiconductor packaging and printed circuit board assembly. Read more ...
MACAO -- Top 15 EMS provider Nam Tai Electronics today reported second-quarter net income rose 110% to $38.8 million despite a 7.4% drop in sales.

For the period ended June 30, the company reported revenues of $197.8 million, down from $213.7 million a year ago. Gross margins were up nearly two points to 11.5%.
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