BUFFALO GROVE, IL – Calling the U.S. “at the forefront of advanced research,” Panasonic Factory Solutions Company of America on June 7 held the grand opening ceremony for its Advanced Packaging Lab.
The lab, located at the company’s suburban Chicago headquarters, contains a class 10,000 cleanroom, plus the latest in metrology and test equipment including x-ray, C-SAM, SEM and EDS for post-assembly analysis.
AUSTIN, TX – Samsung Electronics last week opened a 1.6 million sq. ft. 300-mm NAND flash memory wafer plant in Austin. The $3.5 billion facility will begin operations in the second half and ramp to produce 60,000 wafers monthly by 2008.
The building is one of the largest semiconductor facilities in the U.S.
The plant will begin production with the 16Gb NAND flash chips using 50-nm level process technology.
With the plant, Samsung topped its previous record for the largest foreign investment in Texas, some $1.4 billion in 1996.
The factory is adjacent to the existing 200-mm wafer fabrication plant. The existing plant was completed in 1997 and will continue to be used to manufacture DRAM.