News
PENANG, MALAYSIA – Pac Tech will open a high-volume wafer bumping facility in Penang next year. The 40,000 sq. ft. location will be completed in June and will be designed for mass production of wafer bumping using electroless NiAu, solder stencil printing, wafer sawing, solder-ball placement and more. The facility will reportedly be able to process 600,000 wafers annually to start. The company will begin producing in volume in October.
BRUSSELS -- The EU Commission has opened discussions for its latest round of requests for exemptions to the RoHS Directive.
A list of proposed exemptions is available here.
Among the requests: That all uses of lead in solders be exempted on the grounds that the replacements are more environmentally damaging than the leaded versions.
A list of proposed exemptions is available here.
Among the requests: That all uses of lead in solders be exempted on the grounds that the replacements are more environmentally damaging than the leaded versions.
WASHINGTON — Some U.S. Environmental Protection Agency staff are looking at removing lead from a 30-year-old list of air pollutants, and could recommend the same to the Bush administration.
In an EPA staff paper released Tuesday, agency said it would evaluate the status of lead as an air pollutant and "assess whether the revocation of the standard is an appropriate option for the Administrator to consider."
In an EPA staff paper released Tuesday, agency said it would evaluate the status of lead as an air pollutant and "assess whether the revocation of the standard is an appropriate option for the Administrator to consider."
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