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DEARBORN, MI – The Society of Manufacturing Engineers and its Electronics Manufacturing Tech Group named Professor R. Wayne Johnson winner of its 2007 Total Excellence in Electronics Manufacturing Award. The annual award recognizes extraordinary dedication and innovation in setting new or higher levels of achievement in electronics manufacturing. Johnson is a professor of electrical engineering at Auburn University and director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics manufacturing. His research efforts are focused on the materials, processing, and reliability aspects of electronics manufacturing. Current projects include lead-free electronics assembly, mixed lead-free and Sn/Pb electronics assembly, wafer-level packaging, flip-chip assembly, assembly of ultra thin Si die, and electronics packaging for extreme environments. He has published 52 journal papers, 135 conference papers, six book chapters and co-edited one book on electronics packaging and electronics manufacturing. Johnson holds one U.S. patent.

SAN FRANCISCO – The nation’s CIOs expect IT budgets to grow 5.1% during the next 12 months, down from 5.8% in December. The weaker results reflect increased caution across most product categories, although a rebound in large enterprise spending is expected, says Deutsche Bank Equity Research. DB’s March poll revealed a slow start to 2007, although results for very large (>5,000 employees) and small firms (101-500) strengthened in March, with CIOs expecting growth of 7% and 10%, respectively, in the next 12 months (vs. 3% and 7% in December).

COLORADO SPRINGS – IC Interconnect, a wafer bumping company, was named sole North American representative for Jiangyin Changdian Advanced Packaging, a provider of bumping technologies. The agreement establishes ICI/jcap International, the marketing, sales, engineering and customer support arm of JCAP in North America. Under the agreement IC Interconnect can install and operate its electroless nickel UBM process at a plant in China.