News
CAMBRIDGE, UK – The high-temperature and time-consuming reflow process leaves space for electrically conductive adhesives, according to a new IDTechEx report. ECAs comprise a metal powder embedded within a polymer resin and are well suited to applications that require electronic components to be mounted on anything other than a conventional FR4 substrate, especially when the substrate material is thermally fragile.
WASHINGTON – Global semiconductor industry sales were $47.2 billion in August, an increase of 29.7% year-over-year and 3.3% sequentially, says the Semiconductor Industry Association.
TAIPEI – Foxconn reported record-high third quarter sales of NT$1.4 trillion (US$50 billion), up 8.8% year-over-year and 3.4% sequentially.
Press Releases
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- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration