BANNOCKBURN, IL – After nearly 15 years and plenty of promise but few successes, the IPC today disbanded its Government Relations committee.
The committee has been a focal point for years, having acted as the
trade group’s member liaison to its lobbying activities. It coordinated
an annual industry lobbying day, and helped to raise the industry’s
awareness – if not its influence – at the congressional level.
HERNDON, VA - The International Electronics Manufacturing Initiative’s(iNEMI’s) workshop on the availability of SnPb-compatible BGAs, originally scheduled for January 24, has been moved to March 1. Hosted by Hewlett-Packard, the workshop will occur at its Cupertino, CA campus.
The workshop is intended to facilitate discussion among high-reliability electronic product manufacturers and makers of electronic components manufactured in ball grid array (BGA) packages.
iNEMI’s SnPb BGA Availability Task Group has assembled information that will be shared with BGA device makers, including a list of critical BGA component families; estimated total available market (TAM) for these devices in SnPb assembly versions; a general business case based on TAM; and scenarios to support this critical market need until reliability issues are resolved for high-reliability, long-life electronic assemblies.
WESTLAKE, OH – Nordson Corp. this week finalized
its acquisition of Dage Holdings Ltd.
Nordson
paid £117,005,613 for the testing and inspection equipment manufacturer, which
had revenues of approximately $59 million during the 12-month period ending
Oct. 31.
Nordson
also owns Asymtek, March Plasma Systems and EFD, among others.
The deal
was announced in mid November.
Dage makes
bond testing and digital x-ray systems.