News
MINNEAPOLIS -- The SMTA and Auburn University seek abstracts for the Harsh Environment Electronics Workshop
a two-day program that will focus on assemblies, semiconductor technology, substrates, connectors and lead-free products for use in automotive, space, military and avionics.
Abstracts of 200-300 words should focus on the latest developments, state-of-the-art technology and trends. The deadline is March 22.
The event will be held July 19-20 in Indianapolis.
Contact: conference coordinator Melissa Serres at melissa@smta.org.
Abstracts of 200-300 words should focus on the latest developments, state-of-the-art technology and trends. The deadline is March 22.
The event will be held July 19-20 in Indianapolis.
Contact: conference coordinator Melissa Serres at melissa@smta.org.
UTICA, NY -- Indium Corp. vice president of technology Dr. Ning-Cheng Lee will emphasize reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, AZ, next week.
Dr. Lee’s presentation will depict a supplier’s perspective on the impact and challenges for next-generation flux and paste in drop-critical applications.
Dr. Lee will look at flux and paste formulation directions, expected challenges, assembly implications and challenges, and the shift to using Pb-free fluxes.
Dr. Lee is a renowned expert on soldering and frequent lecturer.
The symposium takes place March 15-16.
Dr. Lee’s presentation will depict a supplier’s perspective on the impact and challenges for next-generation flux and paste in drop-critical applications.
Dr. Lee will look at flux and paste formulation directions, expected challenges, assembly implications and challenges, and the shift to using Pb-free fluxes.
Dr. Lee is a renowned expert on soldering and frequent lecturer.
The symposium takes place March 15-16.
YAVNE, ISRAEL – Valor Computerized Systems announced full support and integration of its Trilogy 5000 assembly line automation software with the SIPlace Pro interface used in Siemens' placement systems.
The integration is important because Siemens has close to a 30% market share worldwide in the component placement market.
The integration enables users to optimize their assembly lines, Valor said.
In a statement, Valor executive vice president for marketing and product management Julian Coates said, “The seamless integration between Valor’s Trilogy 5000 advanced assembly line engineering solution and the powerful SIPlace Pro open interface delivers tremendous cost savings to Siemens customers by generating the fastest route from data load to optimized machine program generation. Siemens customers will enjoy reduced NPI cycle time, increased shop floor productivity, and quicker machine programming and set-up times.”
The Valor tool improves CAD/BoM loading, stencil optimization, rotation neutralization, first-rate machine/line optimization and balancing and NPI debug time, among other features, Valor said.
The integration is important because Siemens has close to a 30% market share worldwide in the component placement market.
The integration enables users to optimize their assembly lines, Valor said.
In a statement, Valor executive vice president for marketing and product management Julian Coates said, “The seamless integration between Valor’s Trilogy 5000 advanced assembly line engineering solution and the powerful SIPlace Pro open interface delivers tremendous cost savings to Siemens customers by generating the fastest route from data load to optimized machine program generation. Siemens customers will enjoy reduced NPI cycle time, increased shop floor productivity, and quicker machine programming and set-up times.”
The Valor tool improves CAD/BoM loading, stencil optimization, rotation neutralization, first-rate machine/line optimization and balancing and NPI debug time, among other features, Valor said.
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