News
MINNEAPOLIS -- CyberOptics reported fourth-quarter sales of $12.1 million, up 17% sequentially and 7.9% year-over-year. For the period ended Dec. 31, net income was $5.2 million, including non-cash income of $3.7 million, up from $626,000 or in the third quarter and $794,000 last year.
Revenue and earnings exceeded company guidance.
Revenue and earnings exceeded company guidance.
Clinton, NY – Assembly materials supplier Indium Corp. offers an Electronics Assembly Reliability Program to meet the performance challenges facing electronics assemblers. The program combines products, service and technologies to optimize finished goods reliability.
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Edina, MN --The SMTA is seeking papers for its third annual International Wafer-Level Packaging Conference and Exhibition. The event will take place on Nov. 2-3 in San Jose, CA, and will track IC packaging and test technologies with emphasis on 3-D stacked packaging.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
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