News
WILLOW GROVE, PA — Kulicke & Soffa Industries today announced definitive agreements to sell its wafer test assets to SV Probe and its package test assets to Investcorp Technology Ventures.
Both deals are subject to closing conditions. No financial terms were announced.
K&S said it the moves would tighten its focus on semiconductor assembly equipment and materials.
K&S said it the moves would tighten its focus on semiconductor assembly equipment and materials.
SANTA ANA, CA -- Christopher Associates has published its latest corporate newsletter. The just published edition highlights the latest equipment lines offered by the distribution firm, including Koh-Young's benchtop 3D paste inspection machine and Japan Unix's robotic soldering units.
Also noted: links to several recent technical papers on AOI and miniaturization.
The newsletter can be downloaded at christopherweb.com.
Also noted: links to several recent technical papers on AOI and miniaturization.
The newsletter can be downloaded at christopherweb.com.
WASHINGTON DC -- The president of the Electronic Industries Alliance has issued a statement applauding the incorporation of recommendations from the business and science sectors in a series of just introduced bills calling for increased funding to the sciences and engineering and tax incentives for R&D.
“EIA commends the bipartisan, three-pronged approach to bolstering America’s innovation infrastructure outlined in the Protecting America’s Competitive Edge bills, said president and CEO Dave McCurdy. The legislators "have done their innovation homework by incorporating proposals and recommendations from the business and science communities that are intent on improving U.S. technological capabilities in the global marketplace."
“EIA commends the bipartisan, three-pronged approach to bolstering America’s innovation infrastructure outlined in the Protecting America’s Competitive Edge bills, said president and CEO Dave McCurdy. The legislators "have done their innovation homework by incorporating proposals and recommendations from the business and science communities that are intent on improving U.S. technological capabilities in the global marketplace."
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration