EL SEGUNDO, CA — Tight supplies, rising prices and increasing demand for DDR SDRAM caused global DRAM revenue to exceed expectations in the second quarter — and boosted the market share of the Taiwanese suppliers that specialize in the part, according to a preliminary estimate from iSuppli Corp.
Worldwide DRAM revenue rose to $7.5 billion in the second quarter, up 14.3% from $6.6 billion in the first quarter. iSuppli had expected revenue growth of only 4.4%.
Many suppliers are phasing out production of DDR in favor of the new mainstream DRAM: DDR2. This constrained supplies of DDR, contributing to an increase in prices. In contrast, prices for DDR2 declined during the quarter as availability increased.
The overall impact was a rise in global DRAM prices of 4% compared to the first quarter.
Three months ago iSuppli had predicted a 4% decline for the quarter, which would be closer to a normal decrease in DRAM pricing.
Confirming iSuppli’s prediction from three months ago, overall DRAM bit production growth worldwide increased by 10% during the quarter compared to 15% during the same quarter last year. This deceleration in bit production growth provided further support for pricing.
Other supply-side factors boosting DRAM pricing included tight availability of DDR2 667 and a shortage of 1Gbit density parts.
“Along with rising prices, tighter supplies and lower production, the DRAM market’s strong performance in the second quarter was fueled by better-than-expected demand,” said Nam Hyung Kim, principal analyst for iSuppli. “PC core-logic chipset suppliers in the second quarter aggressively promoted products that supported DDR, boosting demand for the memory just as DRAM suppliers were phasing out production of the part.”
Due to the rise in DDR prices, the smaller Taiwanese suppliers that are the main suppliers of the part outperformed the tier-one suppliers, according to iSuppli’s preliminary ranking. The three major Taiwanese suppliers, Nanya Technology, Powerchip Semiconductor and ProMOS Technologies, all achieved sales growth of more than 20% sequentially in the second quarter.
Stow, OH – The wafer fab industry's monthly capacity is set to reach a new high next year, increasing 17%, according to analysis firm Strategic Marketing Associates (SMA).
Collectively, the 35 new fabs coming online in 2007 will have the capacity to produce up to the equivalent of 2 million 200-mm wafers. The value of these fabs may reach $56 billion over the next three years.
The expected 17% increase brings with it growth opportunities, as well as the risk of overcapacity, especially in the memory arena, SMA warned.
Up to 60% of the added capacity is expected to be allocated for memory, specifically DRAM and non-volatile flash, which has become ubiquitous in consumer electronics.
FlashPartners, the Toshiba-SanDisk joint venture, may eclipse fab capacity leader Samsung in flash memory, with ambitious plans to bring three 300-mm fabs online by 2008.
Chip foundries are also setting a new record in fab construction, with Taiwan-based TSMC, as well as China-based SMIC and Hua Hong Electronics, planning to bring new 300-mm capacity online next year.
The firm projected equipment sales to near an all-time high. Total capital spending by chip companies is set to grow 14% this year to $47.3 billion, and by 10% next year to $59 billion, just shy of the all-time high of $61.5 billion set in 2000.
BANNOCKBURN, IL — According to trade group IPC, the North American rigid PCB book-to-bill ratio for June was at parity at 1.00, while the flexible book-to-bill climbed back to the positive range at 1.01 after a three-month dip below parity.
The combined (rigid and flex) industry book-to-bill ratio in June 2006 was 1.00. The ratios are based on monthly data collected from PCB producers that participate in IPC’s monthly PCB Statistical Program.
Ratios are calculated by dividing the value of orders over the past three months by the value of sales. A ratio over 1.00 suggests expansion.
Rigid PCB shipments are up 12.5% and bookings rose 19.2% year-on-year. Year to date, rigid shipments are up 11.3% and bookings are up 13.9%. Flex shipments were up 1.7% from June 2005 and up .9% to date. Bookings increased 18.9% YOY, but are down 7.6% YTD. Sequentially, flex shipments and bookings increased 17.4% and 73.8%, respectively.
Rigid PCBs represent an estimated 85% of the current PCB market in North America, according to IPC. In June, flexible circuit manufacturers surveyed indicated that bare circuits accounted for 65% of their monthly shipment value.
Over 88% of PCB shipments reported were domestically produced.