News
LOUISVILLE -- Sypris Solutions Inc.,
a provider of
EMS services, lowered its forecast for the fourth quarter, blaming customer inventories, and delayed shipments and higher-than-expected labor costs.
Sypris today updated its fourth-quarter guidance to breakeven to a loss of 5 cents per share, down from 12 to 15 cents per share. The company forecast sales of $133 million to $135 million, down from previous guidance of $135 million to $140 million for the quarter.
Sypris today updated its fourth-quarter guidance to breakeven to a loss of 5 cents per share, down from 12 to 15 cents per share. The company forecast sales of $133 million to $135 million, down from previous guidance of $135 million to $140 million for the quarter.
SALT LAKE CITY -- Citing 2005 as "a year of great progress" CirTran Corp. founder and president Iehab J. Hawatmeh
said today that the EMS provider was on track for record sales.
"It was a record sales year for CirTran, with more than $80 million in business won, giving us a strong backlog going into 2006," he said.
For the first time as a public company, CirTran reported back-to-back profitable quarters. The thirds quarter was the company's sixth straight quarter of sales growth. In the third quarter, CirTran reported a profit of $575,042, up 204% over the same period in fiscal 2004.
"It was a record sales year for CirTran, with more than $80 million in business won, giving us a strong backlog going into 2006," he said.
For the first time as a public company, CirTran reported back-to-back profitable quarters. The thirds quarter was the company's sixth straight quarter of sales growth. In the third quarter, CirTran reported a profit of $575,042, up 204% over the same period in fiscal 2004.
For the nine months ended Sept. 30, CirTran reported a net profit of $839,543, up 278%. The company has pushed into the homeland security and gaming markets, Hawatmeh said.
Total assets reached $10.7 million, up 12% sequentially and 148% year-on-year.
Hawatmeh said CirTran, which is traded over the counter, is aiming to move to the American Stock Exchange in 2006. "That is a stated goal," he said. "We are working to move closer to meeting the minimum listing requirements and have the Amex in our sights."
FRANKLIN, MA -- Speedline Technologies will tackle the SMT industry's most pressing manufacturing challenges in a new
series of free, monthly webinars.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
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