NEW YORK -- End-market inventories of semiconductors remained low and stable in the September quarter, but
distributors' inventories increased 8%, or $127 million, and 3 days from June.
SG Cowen said that inventories at buyers of semiconductors
appear low and stable. Inventories at 49 major semiconductor customers
fell in both dollar terms
and days on a seqential basis, the firm said.
Portsmouth, RI –International Manufacturing Services (IMS) has appointed W. Howard Associates to represent its products in Colorado, Utah, Montana, Wyoming and Idaho.
W. Howard Assoc., founded in 1983, is a manufacturers representative focused on RF/microwave, interconnect devices and sensor products.
IMS manufactures quality thick film chip resistors, both standard and custom, for applications ranging from automotive sensors to high frequency microwave and medical equipment.
Binghamton, NY -- DEK has published its latest
findings on screen printing with Pb-free pastes, focusing on the
implications for stencil design rules. The results underline the
importance of using an enclosed head and nickel stencils to maximize
quality and yield.
The
report reveals how aperture dimensions must increase to ensure adequate
wetting forces and prevent tombstoning as paste-to-pad and
component-to-pad offsets occur. Such offsets are unavoidable, implying
that manufacturers must re-optimize stencils for Pb-free printing to
ensure yield rates comparable to Pb-rich processes. According to the
report, this issue is more prevalent with smaller components (0402s and
below).
By testing 67 new
aperture characteristics, including varying dimensions, aspect ratio,
shape and stencil thickness, DEK identified the necessary changes in
aperture characteristics. According to the team leader and author of
the report, Clive Ashmore, the main concern is to ensure a higher
volume of paste to compensate for the lower wetting forces exerted by
Pb-free pastes. When placing small chip devices such as passive
components, these wetting forces help retain the component during
reflow. Slight misalignment between the component, solder deposit and
paste leads to imbalance in wetting forces, which increases the risk of
tombstoning.
Ashmore, Global
Applied Process Engineering Group Manager at DEK Printing Machines,
said, “A perfectly centred screen printing process will perform well
whether Pb-rich or Pb-free paste is used. But such processes can only
be sustained under laboratory conditions, which obviously cannot be
provided in a production context. Assemblers must, therefore, take
steps to ensure their stencils are optimised for Pb-free printing. Our
findings show that continuing to use legacy stencils that meet the
Pb-rich design rules will result in significantly higher numbers of
defects.”
Understanding Stencil Requirements for a Lead-Free Mass Imaging Process is available at dek.com.