caLogo

News

NEW YORK -- End-market inventories of semiconductors remained low and stable in the September quarter, but distributors' inventories increased 8%, or $127  million, and 3 days from June.

SG Cowen said that inventories at buyers of semiconductors appear low and stable. Inventories at 49 major semiconductor customers fell in both dollar terms and days on a seqential basis, the firm said.
Read more ...
Portsmouth, RI International Manufacturing Services (IMS) has appointed W. Howard Associates to represent its products in Colorado, Utah, Montana, Wyoming and Idaho.
 
W. Howard Assoc., founded in 1983, is a manufacturers representative focused on RF/microwave, interconnect devices and sensor products. 
 
IMS manufactures quality thick film chip resistors, both standard and custom, for applications ranging from automotive sensors to high frequency microwave and medical equipment.
Binghamton, NY -- DEK has published its latest findings on screen printing with Pb-free pastes, focusing on the implications for stencil design rules. The results underline the importance of using an enclosed head and nickel stencils to maximize quality and yield.
 
The report reveals how aperture dimensions must increase to ensure adequate wetting forces and prevent tombstoning as paste-to-pad and component-to-pad offsets occur. Such offsets are unavoidable, implying that manufacturers must re-optimize stencils for Pb-free printing to ensure yield rates comparable to Pb-rich processes. According to the report, this issue is more prevalent with smaller components (0402s and below).
 
By testing 67 new aperture characteristics, including varying dimensions, aspect ratio, shape and stencil thickness, DEK identified the necessary changes in aperture characteristics. According to the team leader and author of the report, Clive Ashmore, the main concern is to ensure a higher volume of paste to compensate for the lower wetting forces exerted by Pb-free pastes. When placing small chip devices such as passive components, these wetting forces help retain the component during reflow. Slight misalignment between the component, solder deposit and paste leads to imbalance in wetting forces, which increases the risk of tombstoning.
 
Ashmore, Global Applied Process Engineering Group Manager at DEK Printing Machines, said, “A perfectly centred screen printing process will perform well whether Pb-rich or Pb-free paste is used. But such processes can only be sustained under laboratory conditions, which obviously cannot be provided in a production context. Assemblers must, therefore, take steps to ensure their stencils are optimised for Pb-free printing. Our findings show that continuing to use legacy stencils that meet the Pb-rich design rules will result in significantly higher numbers of defects.”
 
Understanding Stencil Requirements for a Lead-Free Mass Imaging Process is available at dek.com.
  Read more ...

Page 4381 of 4864

Don't have an account yet? Register Now!

Sign in to your account