News
ARLINGTON, VA – The monthly electronic component order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) took a slight dip in March after three months of steady upward movement. The 12-month average index that tracks market movement over the past year continued to rise slightly.
The slight downturn in the four-to-five-week floating index does not indicate any long-term pattern, according to Bob Willis, ECA president. "It appears that the market is just pausing for breath," says Willis. "All the vital signs remain good."
Studies by JPMorgan show that component suppliers and distributors have accelerated inventory turns and lowered operating expenses, while prices have remained relatively stable. JPMorgan predicts that major OEM orders will rise 11% this year versus 9% in 2005.
The slight downturn in the four-to-five-week floating index does not indicate any long-term pattern, according to Bob Willis, ECA president. "It appears that the market is just pausing for breath," says Willis. "All the vital signs remain good."
Studies by JPMorgan show that component suppliers and distributors have accelerated inventory turns and lowered operating expenses, while prices have remained relatively stable. JPMorgan predicts that major OEM orders will rise 11% this year versus 9% in 2005.
ST. LOUIS—LaBarge has signed a multiyear agreement with Eclipse Aviation Corp. to provide wiring harnesses for the Eclipse 500, a new aircraft known as a very light jet (VLJ). Initial orders total approximately $10 million.
LaBarge will build more than 80 different complex wiring harnesses that function in electronic systems related to fuel monitoring, landing gear, engine and cockpit functionality. Production is beginning immediately at LaBarge’s Berryville, AK, and Joplin, MO, facilities and is expected to continue through mid-2007.
Eclipse Aviation has said that the Eclipse 500 is on track to receive Federal Aviation Administration certification in late second quarter of 2006 and to begin customer deliveries shortly thereafter. To date, Eclipse has received orders for more than 2,400 Eclipse 500s.
LaBarge will build more than 80 different complex wiring harnesses that function in electronic systems related to fuel monitoring, landing gear, engine and cockpit functionality. Production is beginning immediately at LaBarge’s Berryville, AK, and Joplin, MO, facilities and is expected to continue through mid-2007.
Eclipse Aviation has said that the Eclipse 500 is on track to receive Federal Aviation Administration certification in late second quarter of 2006 and to begin customer deliveries shortly thereafter. To date, Eclipse has received orders for more than 2,400 Eclipse 500s.
HERNDON, VA and PISCATAWAY, NJ —The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components and Technology Conference (ECTC). The workshop is scheduled for May 30, at ECTC in San Diego.
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
For additional info, visit: inemi.org/cms/calendar/06_ECTC_TW_Workshop.html
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
For additional info, visit: inemi.org/cms/calendar/06_ECTC_TW_Workshop.html
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