DES PLAINES, IL —Kester will host a course featuring RoHS/Lead-free training on August 23 and 24 at its Des Plaines facility.

The training gives updated information and practical experience to enable rapid, effective implementation of Pb-free assembly. Will include practical demonstrations of Pb-free assembly and rework process assembly.

On Aug.23, attendees will receive classroom instruction on lead-free alloy selection for SMT; flux-critical selection parameters; equipment requirements; component and board finishes; paste in-hole with lead-free; solderability and how to enhance it; troubleshooting the lead-free SMT process; and thermal profiling for lead-free assemblies. Lunch and a networking session will be provided. Classroom instruction will also focus on compatibility issues; BGA lead-free attach; pin testability and inspection; reliability of SMT joints; preventing and reducing defects; reworking lead-free solder joints; and thermo-gravimetric analysis (TGA) of fluxes and the impact on process.

The half-day session on Aug. 24 provides attendees with a hands-on application session for lead-free SMT process implementation. Attendees are encouraged to bring their boards/application for a lead-free solution .

Attendees will receive a Project 2005: Achieving Lead-Free RoHS Assembly Technical Manual and the Lead-Free Connection Newsletter.

For info. on technical content of the seminars, contact: Peter Biocca, Kester, 972-390-1197 or pbiocca@kester.com. For general info., contact Shirley Wood, Kester, 800-253-7837 or kesteruniversity@kester.com.