BERLIN – The second incarnation of a panel level packaging consortium, PLC 2.0, investigated warpage and die shift in large format reconfigured panels (18" x 24"), and considerable progress has been made toward understanding the root causes. With these insights, the relevant parameters can now be controlled better to enable large-area fine-line RDL processes. The analytical effort has paid off, as RDL could be scaled down considerably on the panel level, making the most of the advantages of both wafer and panel-level technologies and paving the way for an entirely new process chain with new equipment and materials.