Circuits Assembly Online Magazine - Current Issue

News

SINGAPORE --

Flextronics Semiconductor will use a QFN package from Advanced Interconnect Technologies for devices for next-generation consumer electronics, AIT said today.

"AIT's QFN package enables us to leverage power, footprint and performance that renders improved reliability while catering to the fast growing consumer electronics market," said Arnold Virrey, packaging manager at Flextronics.

AIT will also provide turnkey assembly, final test and tape and reel services for Flextronics.

The QFN package is said to provide superior thermal performance to leaded packages because of its exposed leadframe pad, which provides a direct path for removing heat from the package. QFN packages do not have gullwing leads which can act as antennae and create "noise" in high frequency applications.

FRANKLIN, MA – Speedline Technologies has announced a free Web seminar on fine-pitch printing, to be held July 21, at 11 a.m. (EST).

Topics will include:
   • Squeegee selection;
   • Solder paste evaluation ;
   • Lead-free solder paste printing;
   • Stencil design, including pin-in-paste;
   • Aperture design;
   • Board support;
   • Fast cycle time printing;
   • Post-print inspection (2-D and 3-D).

For more info and to register, visit speedlinetech.com/seminars.

The company will continue to offer free Webinars this fall, including a Lead-Free Overview, on Aug. 18, and Lead-Free Wave Soldering, on Sept. 15.

Oulunsalo, Finland -- Juha Hulkko has been appointed chief executive of Elektrobit Group, a Finland-based specialist in the design, life-cycle testing and production automation of electronics products.

A founder of Elektrobit Group and a major shareholder, Hulkko has acted as Chairman since 2002.

Former CEO Juha Sipilä will take over the role of Chairman.

The executive board has been further restructured, with Jukka Harju appointed as COO. He will continue his duties in mergers and acquisitions, and oversee the executive vice presidents responsible for Strategic Business Units and Logistics and Information Management. Johann Haas has been appointed executive VP, Automotive Unit. All other support functions except Human Resources will be directed by CFO Seppo Laine.