News
DES PLAINES, IL — Kester will host a lead-free seminar, “Project 2005: Achieving Lead-free RoHS Assembly” on Sept. 13 at the Radisson Hotel Dallas in North Richardson, TX.
The seminar is designed to assist the electronic industry in the transition to lead-free soldering and RoHS compliancy.
Topics will include: lead-free and RoHS directive overview; supply changes and procurement issues; board/component requirements; lead-free alloy selection for SMT, wave and rework; lead-free wave, and SMT process optimization; impact of dual systems; BGA rework practices; hand soldering process changes; lead-free RoHS reliability; field rework and training; and training and documentation.
Attendees will receive a lead-free assembly technical manual and CD containing presentation materials; technical white papers; and the Lead-Free Connection.
For more information on the technical content of seminar, contact Peter Biocca: pbiocca@kester.com.
For registration details, contact Theresa Rudnick: (847) 699-5580 or visit kester.com.
The seminar is designed to assist the electronic industry in the transition to lead-free soldering and RoHS compliancy.
Topics will include: lead-free and RoHS directive overview; supply changes and procurement issues; board/component requirements; lead-free alloy selection for SMT, wave and rework; lead-free wave, and SMT process optimization; impact of dual systems; BGA rework practices; hand soldering process changes; lead-free RoHS reliability; field rework and training; and training and documentation.
Attendees will receive a lead-free assembly technical manual and CD containing presentation materials; technical white papers; and the Lead-Free Connection.
For more information on the technical content of seminar, contact Peter Biocca: pbiocca@kester.com.
For registration details, contact Theresa Rudnick: (847) 699-5580 or visit kester.com.
SAN JOSE, CA -- Venture Outsource Group is presenting a live Webcast on electronics outsourcing contracts. The event, Electronics Outsourcing Contracts – Development & Negotiations, will take place Oct. 4 at 8:00 a.m. PDT.
The Webcast will be led by VOG president Mark Zetter. Registration and program information can be found at ventureoutsource.com/docs/webinar/contracts.html.
The Webcast will be led by VOG president Mark Zetter. Registration and program information can be found at ventureoutsource.com/docs/webinar/contracts.html.
FRANKLIN, MA – Speedline Technologies and Agilent Technologies have found that positional
accuracy of a paste deposit relative to the pad is the critical
element in ensuring good fine-pitch, lead-free assemblies, and is even
more critical for some formulations than others.
A report on the three-month investigation to understand and quantify variables in a lead-free manufacturing process will be presented at SMTA International in Chicago in September.
A report on the three-month investigation to understand and quantify variables in a lead-free manufacturing process will be presented at SMTA International in Chicago in September.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing