Bromont, Quebec, Canada -- Samsung Electronics Computer Co. will expand its existing Cogiscan Moisture Sensitive Device (MSD) Control system in its Suzhou, China factory.

The system reportedly prevents costly field failures; minimizes number and duration of bake cycles; automates complex procedures; and ensures compliance with J-STD-033A rules/tables and facilitate IPC/JEDEC updates.

Lee Buyung Bum, engineering manager at Samsung in Suzhou, said, “Our most important customers are pleased that we fully comply with all the guidelines of the industry standard J-STD-033A. Our facility is producing some of the most advanced notebook in the worlds. The high density forces designers to place more and more active components on both sides of the same circuit board. This has significant implications in terms of tracking the floor life of moisture-sensitive components. Some of the most sensitive components must go through the complete assembly process, including top and bottom-side assembly and reflow within 24 hours of opening their protective dry bag. In addition the upcoming transition to lead-free products will further reduce the process window associated with MSDs.”