News
Teddington, UK –The National Physical Laboratory (NPL) has created a method for generating materials data from lead-free solder joints under shear with geometries and dimensions mirroring those used in current assembly technology. Such data is important for future FEA modelling.
Lead-free solder does not behave in the same way as lead-containing solder under accelerated thermocycling testing. In particular, the joint is in shear whereas creep data have traditionally been obtained under tensile conditions. This is complicated by the decreasing volume of solder used in electronics interconnection.
Franklin, MA – Speedline Technologies has launched a new Web log (aka “blog”) where the company’s leaders will comment on pressing issues in semiconductor manufacturing and PCB assembly.
At the site (speedlinetech.com/blog), company experts will share insight, technical know-how and personal observations on issues including: lead-free, productivity, development, inspection, globalization and miniaturization.
Gerald Pham-Van-Diep, director of advanced development, has posted the first entry. Pham-Van-Diep sees the blog not only as an exchange of ideas, but as an open structure channel to share personal observations directly with his customers and the industry.
DUBLIN -- The worldwide telecommunications market will double by 2010, according to a just released report.
Research and Markets says telecom sales will hit $282 billion within five years, driven by Internet networks, particularly in existing markets.
Digital, IP and Ethernet will replace other protocols, Research and Markets said. Meanwhile, 3G base stations will work side-by-side with WiMAX 802.16 base stations in urban areas.
Today's largest existing markets are forecast to grow to $446.9 billion by 2010, up from $197 billion this year.
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