by Mike Buetow
KUALA LUMPUR, Jan 14 - Solectron Corp.
will close one of its four factories here in May and pay a reported
$1.6 million to the 750 displaced staff, a local newspaper reported
today.
The Business Times reported
Solectron said the Johor plant was no longer viable due to customers'
changing needs. Most of the business will be transferred to other sites
in the region," Joe Tang, south Asia operations vice president, was
quoted as saying.
Solectron employs more than 7,000 workers at its four manufacturing plants here.
Analysts feel the nation's electronics manufacturers are migrating to lower cost regions, the Business Times said.
ALAMEDA, CA, Jan. 14 - Technology Forecasters Inc. forecast that last year's double-digit growth for the EMS and ODM industry will continue into 2005.
In its latest report, the market research group forecasts average growth rates over the next five years of 15% for EMS, 20% for ODMs, and 16% for all outsourcing.
Overall drivers for healthier growth include the fact that EMS companies, led by Flextronics, are making a major commitment to the ODM model to maintain customers. "There are more opportunities for cooperation between ODM and EMS companies," said vice president Eric Miscoll. "As ODMs brand their products and push into the OEM space, there's less competition between the ODM and EMS business models, because they send their manufacturing to EMS."
TFI also reported:
The firm's next quarterly market meeting takes place March 9-10 in Guadalajara and features comparisons between manufacturing in Mexico. Also to be covered: outsourcing lessons learned in computers, environmental compliance in low‑cost regions and a panel discussion on the current status of manufacturing in Mexico.
by Mike Buetow
Jan. 14, West Haven, CT - Enthone
Inc. will discuss the latest
in lead-free final finishes and microvia metalization during a series of presentations
at an upcoming trade show.
Enthone will sponsor
30-minute presentations at the booth of its parent company, Cookson
Electronics, during IPC Apex/Printed Circuits Expo. The sessions will
provide the most recent advancements in. The include:
Presentations will cover advancements
in microvia fill applications using patented direct metalization and copper via
fill systems, and lead-free silver finish OSPs said to be able of handling
multiple reflows.
Presentations will be made on Feb. 22 and 23. Seating is limited; email Barry Lee Cohen at bcohen@cooksonelectronics.com to reserve.