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SUNNYVALE, CA -- The battle of the chip titans is on. Again. Advanced Micro Devices on Monday filed an antitrust lawsuit alleging Intel forces customers into deals that excludes them from buying AMD's components.

In the suit, AMD alleges Intel has given cash and other incentives to companies such as Dell, Sony, Toshiba, Gateway and Hitachi -- 38 companies in all -- in exchange for exclusive deals. 

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RALEIGH, NC-- Weller, a Cooper Hand Tools brand (cooperhandtools.com), is presenting a series of lead-free soldering seminars to explain this essential technology and to prepare electronics manufacturers for the 2006 deadline for compliance with RoHS directives.

The seminars, presented in association with Omni Training and Techni-Tool, will be held in Cleveland, OH on August 24; Detroit, MI on August 26; and in Cedar Rapids, IA on August 27.  Ken Moore, president of Omni Training, will conduct the sessions.

The sessions will cover the impact, challenges and risks associated with lead-free, including thermal-related damage to PWBs and components. The primary focus is on hand soldering, rework and inspection of solder joints made with lead-free alloys.  Attendees will work with various lead-free alloys and soldering equipment.    

For details contact Maria Eby, (610) 940-5425; mariae@technitool.com.

Irving, TX – EMS provider Elcoteq Network Corp. opens its Engineering Service Center (ESC) in Richardson, TX, today. A ceremony marking the event featured speeches by Richardson mayor Gary Slagel and Elcoteq Americas president Dr. Doug Brenner. 

The center occupies 28,117 sq. ft and employs 100 people. Services include project management, prototyping, industrialization, low-volume manufacturing, test services and material management. Products will include mobile networks, broadband access and wireless LAN, and home communications products, as well as board assembly, module and systems for cellular base stations, switches, microwave and broadband access products. 

The facility is ISO 9001 certified and RoHS compliant. Capabilities include automated PCB assembly and flip-chip assembly at less than 300 micron pitch, underfill, a lead-free production process, 0201 production placement and rework processes, AOI, BGA replacement and reball, x-ray inspection, mechanical assembly, final build packout service, design for manufacturing and build report documentation, real time quality data collection and an intranet based manufacturing data system.

 

 

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