News
SINGAPORE – A*STAR’s Institute of Microelectronics (IME) is collaborating with four companies to form a system-in-package (SiP) consortium, say reports. IME will team with Asahi-Kasei, Globalfoundries, Qorvo and Toray to develop high-density SiP for heterogeneous chiplet integration for 5G and other applications.
TAIPEI – Foxconn said it is talking to Wisconsin about building electric vehicles there, according to reports.
ATLANTA, GA – UP Media Group Inc. seeks abstracts for the upcoming PCB East technical conference, coming to the Boston suburbs next spring. The conference will focus on training and best practices for electronics design engineers, fabricators and assemblers.
Press Releases
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- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager