News
Specialty Coating Systems (SCS, Indianapolis, IN), a Cookson Electronics Company, has introduced Parylene HTSM conformal coating for the automotive, industrial, military and electronics industries. The coating provides protection to parts and electronic components that operate in harsh environments where temperature, chemical, electrical, moisture and UV stability challenges exist.
The coating meets the specifications of component manufacturers with long-term thermal stability up to 350ºC, with intermittent exposures up to 450ºC. It also offers UV stability, crevice penetration, a low dielectric constant and a low dissipation factor.
It is applied at room temperature via a vapor deposition polymerization process, resulting in a pinhole-free, protective coating. The coating is inert, solvent and catalyst free, does not out-gas, and in ultra-thin coatings results in little dimensional or mass change to the coated component.
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments (Binghamton, NY) is bolstering its high-speed chip placement offering with the introduction of the Quadris placement machine. The placer sets out to satisfy the demands of manufacturers who need very high placement rates, high productivity and reliable performance in placing small passives, larger leaded and area array packages or non-standard components.
The hybrid four-beam surface-mount placement system incorporates the advantages of turret-style and overhead gantry technologies. With dual-drive linear motors, it achieves 62,000 cph placement speed within a small footprint.
Reliable operation is achieved via proven turret technology. The machine places small surface-mount device passives and 0201s, while also addressing advanced packages including chip-scale packages (CSPs), ball grid arrays (BGAs), quad flat packs (QFP) and non-standard components with edge length up to 20 mm.
The machine features automatic placement height optimization through on-the-head CCD linear sensors. Patented 12-spindle direct-drive heads have on-the-fly gang recognition. A board transfer system automatically centers the printed circuit board between feeder banks for optimal balancing across the beams. Bank feeder change and splicing capabilities facilitate rapid replenishment and product changeovers.
Copyright 2004, UP Media Group. All rights reserved.
DVT Corp. (Duluth, GA) has entered into an agreement to acquire MTI Machine Vision LLC (Providence, RI), a company known for its semiconductor wafer reading algorithms. Under the agreement, DVT is acquiring the rights to MTI's machine vision software products and intellectual property, as well as other related assets.
Bob Steinke, DVT Chairman and CEO, said, "We see this acquisition as an opportunity to combine MTI's algorithm library with DVT's range of smart camera-based, general purpose vision systems."
MTI founders, Drs. Stuart Geman and Donald McClure, noted that MTI's machine vision customers can expect a seamless transition after the acquisition is completed. "The Providence facility will house a DVT technology group dedicated to the development of advanced algorithms and software product development that will benefit both customer bases."
"The acquisition of MTI's machine vision business allows DVT to begin deployment of easy-to-use, smart-camera products featuring MTI software," McClure added.
DVT expects that the first products to benefit from this venture will include semiconductor wafer reading OCR, barcode and 2-D identification algorithms as well as alignment and defect detection software. MTI's solutions for recognizing degraded images and identifying patterns have been adopted by many vision and inspection original equipment manufacturers (OEMs), and MTI's success in the semiconductor wafer industry will allow DVT broader access to another machine vision market.
Copyright 2004, UP Media Group. All rights reserved.
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