News
Valor Computerized Systems (Yavne, Israel), a provider of productivity increasing engineering software solutions to the electronics design and manufacturing industry, announced that it has received orders for its Trilogy 5000 Assembly Engineering platform from Taiwanese original design manufacturer (ODM) Inventec.
Valor's decision to concentrate on the Far East as the largest emerging marketplace for outsourced electronics manufacturing services (EMS) has recently been affirmed through additional sales of the assembly platform to PC notebook, desktop and server manufactures in Taiwan, who are facing globalization challenges in the electronics manufacturing arena and need to offer trans-continental portability solutions to their internationally operating customer base.
"The new product introduction market in Taiwan is one of the most dynamic in the world, in terms of product types and products shipped," said Uri Michaelis, president of Valor Far East. "Taiwan manufacturers, as a whole, ship more than 65% of notebook PCs to the world markets. The fact that many Taiwanese manufacturers transfer production lines to China, makes it a key market in terms of defining the technology needs in Greater China."
Valor's Far East organization currently has five offices in Hong-Kong, Taiwan, South, East and North China, and expects to double its work force within the year.
www.valor.com
Copyright 2004, UP Media Group. All rights reserved.
Digi-Key Corp. (Thief River Falls, MN) has announced the addition of Tim Sanghera as vice president of semiconductor products. Sanghera brings 15 years of experience in marketing, sales and technology expertise in the semiconductor industry. His mission will be to enhance the company's semiconductor product portfolio by working in concerted effort with its current supplier base.
Mark Larson, president, said "Digi-Key's strength in the semiconductor area is rapidly growing and we are pleased to have Tim's expertise as part of our team. His knowledge of the industry in general and semiconductors specifically makes him uniquely equipped to further drive sales growth for Digi-key semiconductor vendors."
Prior to joining Digi-Key, Sanghera was the Distribution Sales Manager for the America's at Winbond Electronics and was instrumental in business development and marketing for Mix Signal, uC, Non-Volatile, I/O and Memory products. Before that, he held positions at Sharp Electronics as part of the Distribution Sales Team, including marketing of key LCD, Opto, Memory and ARM based products. In total, Sanghera has spent more than 15 years in the Semiconductor Industry in various management positions responsible for the company's corporate and product line marketing, strategy development and corporate technology programs.
Digi-Key Corp. is a full service provider of prototype/design as well as volume production quantities of electronic components.
Copyright 2004, UP Media Group. All rights reserved.
The first annual International Wafer-Level Packaging Congress (IWLPC), co-sponsored by the Surface Mount Technology Association (SMTA, Minneapolis, MN), will be presented at the San Jose Doubletree Inn, San Jose, CA, on Oct. 10-12. The congress includes three days of technical programming and two full days of exhibits presented by suppliers to the semiconductor packaging and testing industry.
Dr. W.R. "Bill" Bottoms, chairman of Third Millennium Test Solutions, will present the dinner keynote speech on October 11. The title of his address is "Wafer-Level Packaging: Why and Why Not?" With a Ph.D. from Tulane University, Dr. Bottoms has an extensive background in academia, venture funding and in the commercial semiconductor equipment sector.
After receiving his doctorate in physics, Dr. Bottoms joined the electrical engineering faculty of Princeton University, where he remained until 1976. He then joined Varian Associates in Palo Alto, CA, as manager of research and development, and he was later named president of Varian's newly formed semiconductor equipment group. After leaving Varian, he was senior vice president and general partner at Patricof & Co.
Ventures Inc., an international venture capital firm. He founded Third Millennium Test Solutions in March 1999.
Dr. Bottoms has also served on a number of government and industry committees and advisory positions, including chairmanship of the subcommittee of the Technical Advisory Committee of the U.S. Commerce Department's Export Control Commission for Semiconductor Equipment and Materials.
Joseph Fjelstad, co-founder of SiliconPipe Inc., and Dr. Ken Gilleo of ET-Trends LLC will co-chair the technical program. Both are widely known speakers on semiconductor packaging and interconnection topics. In addition to its focus on wafer-level packaging, the congress will explore many topics in chip-scale packaging and other advanced packaging processes.
Copyright 2004, UP Media Group. All rights reserved.
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