News
The Metcal (Menlo Park, CA) division of OK International has developed a flexible optical inspection system for use with large boards measuring up to 36 x 36 in. The VPI-1000-XL system is the latest addition to the company's range of optical inspection systems for inspection of array packages and surface-mount devices.
The system meets all inspection requirements on larger boards, which are becoming increasingly common in applications such as cellular base stations, data communications and network servers. It features four adjustable supports to hold round, rectangular, square or l-shaped printed circuit boards (PCBs) and has an articulating arm capable of spanning up to 24in., allowing it to cover a 36 x 36 in. board without requiring a lens change.
Metcal's NovaScope lens design is capable of moving through 90° left/right and 20° up/down, so operators can inspect under array packages with standoff heights as low as 0.002 in. (0.05 mm) and clearances of just 0.043 in. (1.1 mm) between components. The optical design is sharper and clearer - using 2/3 fewer optical elements to send a direct image to the high-resolution CCD camera.
The integrated optical design is a departure that moves beyond typical endoscopic systems and gradient lenses. While conventional designs relay an internal image repeated throughout the length of the endoscope, an approach requiring multiple sets of complex optical elements to perform the task, NovaScope has only one image: the image in front of the eyepiece.
In operation, the system floods the underside of a component with bright white metal halide light that replicates natural daylight, enhances the color rendering and produces images on the system's color LCD monitor. The lens looks underneath array packages to inspect each ball and its top and bottom connections. With a quick turn of the lens adjustment ring, operators can move through the underside of the device to check for defects such as bridging, cold solder joints, open circuits, excess flux, contamination and other process-related failures.
The unit can also be used for inspecting surface-mount devices and any other board feature without changing lenses. Apertures on stencils can also be inspected with ease.
A software tool completes the package, allowing users to measure, record, annotate, analyze and communicate component information. Images are displayed in real-time for a visual inspection of the soldering process, and they can be captured and stored for future reference or reports. Documents can also be emailed or archived for use in training, research and development or quality insurance.
Copyright 2004, UP Media Group. All rights reserved.
The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA) continued its slow upward movement in March, creating hopes that profits will follow.
"We're continuing to see a gentle increase that is consistent with our conversations with manufacturing executives," said Bob Willis, ECA president. "The prevailing hope from manufacturers is that average selling price (ASP) will begin to rise in concert with sales."
According to Willis, manufacturers are reporting some isolated supply shortages, which could spur demand and raise ASPs. Recently, UBS Securities reported that multi-layer chip capacitor (MLCC) supply is expected to fall short of demand in the second half of 2004, which could create a 5 to 15% price increase. In other areas, however, even substantial growth will not ease price pressures. Market researcher IDC predicts a compound annual growth rate of 15% for LCD panels between 2003 and 2007, with 56% growth in 2004 alone. But, IDC predicts the market will be oversaturated during that period, leading to price erosion.
The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance (EIA), comprising more than 2,100 members that reportedly represent 80% of the $430 billion U.S. electronics industry.
Copyright 2004, UP Media Group. All rights reserved.
Self-laminating
labels (SB) from Tyco Electronics (Harrisburg, PA), a business segment
of Tyco International Ltd., can mark and identify wires and cables used
in most
applications. The labels use thermal transfer technology for
marking, employing a translucent vinyl film substrate with a permanent
acrylic adhesive. The labels are supplied with a white printable area
that is over-laminated upon application with the translucent portion of
the label. The labels are used in a range of electrical and electronic
application, as well as in factory automation and communications
equipment.
The
self-lamination of the labels protects the printed area from exposure
to oil, solvents, water and abrasion. The labels conform to round,
irregular or flexible surface and are suitable for use in applications
where the cable or wire is flexed repeatedly. For added application
flexibility, labels can be flagged around a wire compared to
traditional wrapping.
SB self-laminating labels have a typical shelf life of two years and a service temperature of -40 to 82°C. The minimum application temperature is 10°C.
These labels can be imprinted with the T308S or T312M thermal printers.
Thermal transfer ribbons from Tyco Electronics are recommended.
www.tycoelectronics.com
Copyright 2004, UP Media Group. All rights reserved.
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