Tecnomatix Technologies Ltd. (Herzlia, Israel), a provider of manufacturing process management (MPM), announced that Bosch Security Systems Ltd. has selected eMPower solutions from Tecnomatix Unicam for its manufacturing site in China. Tecnomatix Unicam is a wholly owned subsidiary of Tecnomatix Technologies.
The solutions—including eM-Assembly Expert and eM-Test Expert—will help the company facilitate machine setup and reduce the impact of product changeover in the company's high-mix, low-volume manufacturing environment. Eventually, Bosch plans to extend the application to the shop floors as well. This initiative will begin with the Bosch Security Systems facility in Zhuhai, South China.
Tecnomatix Technologies Ltd. also predicted that sales will rise by 15 to 20% in 2005 on top of the 15% growth projected for 2004, helped by higher demand from manufacturers and cost-cutting efforts.
Tecnomatix, a provider of robotic simulation and engineering software, has weathered a three-year slump by reducing 25% of its work force. Demand started to pick up in the December quarter, as it signed a $50 million contract with a major U.S. automotive maker.
In 2003, the company posted revenue of $86.3 million and a loss of $10.3 million.
The bulk of Tecnomatix's revenue comes from Europe and North America. It is expanding rapidly in China, where it faces the double-edged sword of surging demand and rampant piracy.
Copyright 2004, UP Media Group. All rights reservedDigi-Key Corp. (Thief River Falls, MN) and AVX (Myrtle Beach, SC) have signed a global agreement allowing Digi-Key to distribute AVX products. For AVX, Digi-Key will serve as a channel partner, managing an extensive customer base that includes technology leaders as well as small and emerging customers. AVX will enhance Digi-Key's product offering in a variety of categories allowing customers more choices in component technology.
Mark Larson, president of Digi-Key, said, "Digi-Key's ability to provide off-the-shelf delivery on a broad range of AVX components for both prototype and production needs should translate into a real advantage for Digi-Key's customers."
AVX capacitor products are widely used and Digi-Key meets the specific demands of this important area of the electronics market. Digi-Key offers a variety of standard AVX capacitors, oscillators, varistors and interconnect, as well as more innovative products like the OxiCap, which is a low voltage, non-burn capacitor, ideal for replacing surface-mount device (SMD) aluminum electrolytics.
Digi-Key is a full service provider of prototype/design as well as production volume quantities of electronic components.
Serving a broad range of markets including: telecommunications, data processing, automotive, consumer and medical sectors, AVX serves the passive electronic component and interconnect products industries.
Copyright 2004, UP Media Group. All rights reserved.
phoenix|x-ray Systems + Services Inc. (Camarillo, CA) has introduced the nanome|x, a high-powered nanofocus four-in-one failure analysis system. The x-ray inspection and failure analysis system can perform sophisticated nondestructive testing processes and resolve minute details. The system is designed to meet manufacturers' requirements of complex semiconductor devices and highly integrated electronic assemblies, yet can be used in the field of micromechanics and material testing as well.
The design is a result of a close partnership with its customers across several fields of applications. As a result, the system uses a high-powered nanofocus tube that can be operated in four modes covering the range from nanometer resolution to high-power radiation. Users can resolve an extreme level of detail (200-300 nm or 0.2-0.3 microns), displaying the slightest defect in miniaturized assemblies, such as pad wetting failures in flip chip solder joints or cracks in bond wires with verifiable results.
The same tube is infinitely variable up to 160kV and can also power up to 50W to see through highly absorbent materials like tungsten alloys used in IC packages or injector nozzles or microelectromechanical systems (MEMS).
The system deploys the company's ovhm|module technology that, without rotation of the board and thus loss of magnification in the oblique, allows for a high magnification (2000x) and 3-D-like imagery with 2-D magnification acquisition speeds. The tube and detector rotate up to 70° around the sample while providing the needed oblique view necessary to see minute defects in small solder joints found in fine-pitch ball grid arrays (FBGAs), microBGAs, column-grid arrays (CGAs), chip-scale packages (CSPs) and flip chips. This option is ideal for determining z-position solder voids, inspecting wetting quality, detecting cracks in bond wires, inspecting BGA device joint stacks and ball bond quality and measurement of via plating in both IC and printed circuit board (PCB) production.
The intensifier in the system is a digital detector technology and video system that delivers distinct images in pseudo real-time of poor absorbing materials with enhanced contrast.
Additional features include the automated inspection of BGA and quad flat pack (QFP) solder joints by an algorithm for the automated pad wetting analysis, software for the automated backend, software for the automated die-attach voiding calculation following user-defined standards and an ergonomic design for comfortable operation.
Copyright 2004, UP Media Group. All rights reserved.