News
The Surface Mount Technology Association (SMTA, Minneapolis, MN) has announced the program for the International Wafer Level Packaging Congress on Oct. 10-12 in San Jose, CA. The program is now available live on the SMTA Web site.
The exhibition will track leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. It includes a three-day technical program and two days of exhibits presented by leading suppliers to the semiconductor packaging and testing industry.
Full details on the courses, technical sessions and special events can be found at: http://www.smta.org/iwlpc/.
Copyright 2004, UP Media Group. All rights reserved.
Valor Computerized Systems (Yavne, Israel), a provider of manufacturing productivity solutions to the electronics industry, announced that IPC (Northbrook, IL) has recognized the company with its Special Recognition Award. This award, presented on behalf of the printed circuit board (PCB) and electronics manufacturing services (EMS) industry, their suppliers and customers, is in appreciation of Valor's commitment in developing IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, and its donation of the ODB++ (X) format.
"By generously donating their ODB++ format to the IPC committee working on IPC-2581 and by providing volunteer committee support from their development group in Israel, Valor made tremendous contributions to the development of this new standard and notably displayed its dedication to the industry," said David Bergman, IPC's vice president of standards and technology. "The time and travel commitment to the two-year standard was significant on Valor's behalf, and IPC would like to recognize Valor's efforts to and support of the industry."
The standard is the result of three years of a collaborative industry initiative, initially started by the National Electronic Manufacturing Initiative (NEMI) and followed by IPC's standardization effort. The standard is in XML schema and was built on Valor's ODB++ format, with added data concepts from IPC's GenCAM standard (IPC-2511B).
Copyright 2004, UP Media Group. All rights reserved.
IPC (Northbrook, IL) recently presented Mateusz Czerw, Eric Li and Edwin Moy with $500 scholarships from the IPC Electronics Assembly Scholarship Fund, an endowment the association established to support the electronics program of Curie Metropolitan High School in Chicago, IL. IPC also donated $1,000 to the school for additional educational materials and equipment for Curie's electronics program.
In addition to maintaining a 3.0 GPA in electronics, sustaining a 90% attendance record and establishing a history of achievement in electronics at the school, the students were selected by Curie's electronics instructor, technical department counselor and education-to-careers coordinator for submitting exemplary written essays that described their post-secondary educational plans and future career goals.
"IPC has always valued education and we will continue to support efforts that grant students an opportunity to further their training in the electronics field," said IPC president Denny McGuirk.
In 2003, Circuits Assembly magazine and Technology Forecasters financed the $10,000 fund through a portion of entry fees from past Service Excellence Awards programs. IPC donates $2,500 each year to the career academy that includes a magnet school for the arts, a vocational/technical program and an international baccalaureate program.
IPC selected Curie Metropolitan High School as the sole beneficiary because of the school's three-year industrial electronics course that gives students work-oriented, hands-on experience using the latest advancements in business and technology. Curie is one of the only high schools in the U.S. to use IPC-A-610C, Acceptability of Electronic Assemblies, as a standard in its industrial electronics curriculum.
Copyright 2004, UP Media Group. All rights reserved.
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