News
The Lightning high-speed placement head from Universal Instruments Corp. (Binghamton, NY) has been selected for the Innovative Technology Showcase at IPC APEX, to be featured next week in Anaheim, CA. Choosing from technologies from all APEX exhibitors, IPC commended the new placement head's solution to the challenges of modern surface-mount assembly.
These challenges include accurately placing new package styles at full speed, including next generation chip-scale packages (CSPs) and sub-0201 passives. The placement head addresses the speed challenge through patented variable reluctance motor (VRM) technology. Developed for true rotary application, VRM enables the head to index its spindles within 55 ms. The head has 30 spindles, yielding high placement rates in a pick-and-place configuration.
The placement head also features dual on-the-head cameras, enabling accurate placement at full speed from sub-0201 components to CSPs, wafer-scale packages (WSPs), microBGAs and others up to 30 mm square.
The optional embedded process verification using the CyberOptics EPV™6 system, operating concurrently with placement, provides two images at every pick-and-place event for immediate process analysis and refinement.
The head is compatible with the company's AdVantis and dual-head Genesis modular placement platforms. It enables 30,000 cph placement rates in the AdVantis application. Genesis can perform at 54,000 cph high-speed placement when fitted with twin Lightning heads.
The Christopher Group (Santa Ana, CA) will be exhibiting the NSpec Fv 20 large format automatic optical inspection (AOI) system for printed circuit board (PCB) assembly applications at IPC APEX in Anaheim, CA, on Feb. 24-26.
The NSpec Fv series systems are used in 2-D solder paste, pre reflow and post reflow applications and can inspect panels up to 20 in. x 26 in.. Optional features include off line programming, off line verification/repair stations and line monitoring and control software. Bench top and in line systems are fully compatible, and all systems include an 18-month warranty.
Other systems to be exhibited include the SmartOptics S8M 3-D solder paste inspection system, HC 610 PCB hole inspection system, SynPower PCB measurement/inspection system and Koki solder pastes and wave soldering fluxes.
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Transition Automation (North Billerica, MA) recently introduced the newest product in the Board-Lok tooling family: the Flex-Kit™ Board Support System. This product supports bare surface-mount boards when they are passed through the printing machine.
The system gives support over a range of board sizes from 2.5 in. to 17 in. wide. The kit is supplied with four sections that may be set side by side in various widths, which provides 15 possible combinations.
The system gives nearly full area support for varying product widths, which allows for better process parameters such as cycle speed and print accuracy.
Ergonomics and electrostatic discharge (ESD) protection are central to the product design. Support elements are lightweight, rugged and visible. Magnets and optional tooling pins secure the system into position. Each of the different sections of the system is able to nest within one another.
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