News
LYON, FRANCE -- “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.”
NEW YORK -- One Equity Partners today announced it has completed the acquisition of a 29% stake in Cicor Technologies, a Swiss provider of electronics manufacturing services, to become the company's largest shareholder.
DALLAS, TX – Six US universities established a research center to address protection of the security of semiconductors, PCBs, and other computer hardware, according to reports.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing