WASHINGTON – The US Department of Commerce is establishing an early alert system to detect supply chain shortages in the semiconductor industry, according to reports.
CAMBRIDGE, UK – The high-temperature and time-consuming reflow process leaves space for electrically conductive adhesives, according to a new IDTechEx report. ECAs comprise a metal powder embedded within a polymer resin and are well suited to applications that require electronic components to be mounted on anything other than a conventional FR4 substrate, especially when the substrate material is thermally fragile.