News
AUSTIN, TX -- TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch.
NEW DELHI, INDIA -- The US isn't the only nation placing intense emphasis on its boosting domestic semiconductor industry.
NEEDHAM, MA – The Covid-19 pandemic had a positive impact on the tablet market in 2020 as consumers, businesses, and schools sought tablets to stay connected, entertained, or productive.
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