News
TORONTO -- Celestica today withdrew its previously announced first quarter financial guidance, citing government-driven factory shutdowns stemming from the Covid-19 outbreak.
MINNEAPOLIS, MN – The best papers from SMTA International 2019 were announced. Chris Gourlay, Imperial College London, won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High-Reliability Pb-Free Solders Containing Bi, Sb, In."
LYON, FRANCE – Fan-out packaging adoption has grown in the past year, with TSMC the leader, according to a new report from System Plus Consulting and partner Yole Développement. Samsung subsidiary Semco is most likely second, say the firms, with PTI as a potential OSAT outsider in FO.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Long Island Expo & Tech Forum
- BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America
- High-Performance TIMs: Beyond Traditional TIM Materials
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum