News
SAN JOSE, CA – Sanmina reported fiscal third quarter revenue of $1.7 billion, up 4% year-over-year and down 18.4% sequentially.
MILPITAS, CA – The global semiconductor packaging materials market will grow from $17.6 billion in revenue in 2019 to $20.8 billion in 2024, a 3.4% CAGR, says SEMI and TechSearch International.
BLAUBEUREN-SEISSEN, GERMANY – Rehm Thermal Systems has added a new building to its headquarters here, and many employees have already moved to the new site.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing